Monolithic Triple 9. General Description. The IC con-. Each chan-. The IC is packaged in an industry standard 9-lead TO
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Monolithic Triple 9. General Description. The IC con-. Each chan-. The IC is packaged in an industry standard 9-lead TO See Thermal Considerations. Schematic and Connection Diagrams. Simplified Schematic Diagram. One Channel. Note: Tab is at GND. Top View. Order Number LMT. Application Hints Continued. Referring to Figure 9 , there are three components R1, R2.
Increasing the values of R1. Increasing the value of L1 will speed up the circuit as. It is very important to use induc-. Ferrite core inductors from J. Miller Mag-. The val-. The NSC demo board also. Using vari-. Once the optimum values are determined.
Figure 8 shows the effect of increased load capacitance on. This demonstrates the importance. Figure 7 shows the variation in rise and fall times when the. The rise time shows a maximum variation relative to the cen-.
The fall time shows a. Figure 4 shows the performance of the LM in the test. The figure shows that the rise time of the LM increases. This corresponds to a speed degrada-. The fall. Figure 6 shows the maximum power dissipation of the. LM vs Frequency when all three channels of the device. This graph gives the designer the information. The designer should note that if the load capacitance. The LM case temperature must be maintained below. MHz bandwidth then a maximum heat sink thermal resis-.
This example assumes a capacitive load of 8 pF and no re-. A typical application of the LM is shown in Figure Used in conjunction with an LM, a complete video chan-. Figure 10 is the sche-. For optimum performance, an adequate ground plane, isola-. Also, the length of the. The following references are recommended:. Ott, Henry W. Semiconductor Application Note Pease, Robert A. Butterworth-Heinemann, Because of its high small signal bandwidth, the part may os-.
To prevent this, leads to the. Figure 11 shows routing and component placement on the. The schematic of. This board provides a good. Note the location of the following components:.
V CC clamp diodes. Very important for arc protection. Figure 12 shows the. Note that the components are placed so. This is done to. Note also that D14, D15, R29 and D13 are. This minimizes parasitic capacitance in the. The anode of protection diode D14 is con-. The cath-. The diode placement. The IC is packaged in an industry standard 9-lead TO molded plastic power package.
See Thermal Considerations section. PDF Datasheet ]. SparkFun Electronics. Allied Electronics DigiKey Electronics. Arrow Electronics Mouser Electronics. Chip One Stop. National Semiconductor. The function is LM Monolithic Triple 9. Texas Instruments.
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